2UUL BG03 Reballing Stencil for iPhone 17 Series

2UUL BG03 Reballing Stencil for iPhone 17 Series

The 2UUL BG03 Reballing Stencil for iPhone 17 Series is a professional-grade BGA/IC reballing tool designed specifically for mobile board-level repair on the latest iPhone 17 generation. Whether you’re restoring solder connections on CPU, NAND, baseband or other IC chips, this precision laser-cut stainless steel stencil ensures accurate solder ball alignment and uniform reballing results — helping technicians achieve consistent, high-quality board repairs with minimal rework.

Crafted for repair shops, service centers and expert technicians, the BG03 stencil is engineered to withstand repeated use and heat exposure during hot air or reflow station operations. Its durable stainless steel construction resists warping and maintains hole integrity for reliable solder paste placement. Whether you’re working on tight-pitch BGA pads or complex logic board components, the 2UUL BG03 reballing stencil helps deliver clean, repeatable solder joints and professional repair outcomes.

⭐ Key Features

• Precision Laser-Cut Design — Ensures accurate solder ball placement on BGA/IC pads.
• Stainless Steel Construction — Durable and heat-resistant for repeated professional use.
• Optimized for iPhone 17 Series — Tailored support for the latest Apple logic board IC patterns.
• Uniform Solder Ball Formation — Improves consistency and reduces rework.
• High-Temperature Tolerance — Suitable for use with hot air and reflow stations.
• Reusable & Long Lasting — Maintains stability and precision over many repair cycles.
• Compact & Easy to Handle — Fits well with precision tweezers and rework setups.
• Essential for Board-Level Repair — Ideal for CPUs, memory chips, PMIC, and other BGA/IC.
• Professional Repair Quality — Designed for technicians and mobile refurbishment labs.
• Improves Repair Efficiency — Speeds up solder paste printing and reballing workflows.

⚙️ Technical Specifications