2UUL SC94 Metal Polish f2UUL JOINT X Solder Paste for Repair 158℃/183℃//200℃/ 50gor Cleaning Phone Frames & Shield Covers (Copy)

Description

2UUL JOINT X Solder Paste for Repair 158℃/183℃//200℃/ 50g

The 2UUL Joint-X Solder Paste for Repair (50 g) is a premium solder paste developed for technicians performing mobile phone motherboard repairs, PCB rework, BGA reballing and general electronics soldering. Designed with multi-phase melting characteristics (158 °C, 183 °C, 200 °C), this paste provides smooth solder flow, excellent wetting ability and reliable joint strength across a variety of components and board types.

This versatile solder paste is ideal for use with hot air stations, soldering irons, preheaters and rework systems, allowing you to tailor your workflow with temperatures that match specific repair needs. Whether you’re tackling fine-pitch components, micro-BGA packages, or larger contact joints, Joint-X ensures consistent thermal response, minimal bridging and reduced cold joints.

Formulated for professional repair environments, the 50 g jar delivers stable performance, longer shelf life and superior adhesion to pads. The balanced flux activity reduces oxidation and enhances solder quality — making the 2UUL Joint-X Solder Paste an indispensable tool in any serious technician’s toolkit.

⭐ Key Features

• 🔥 Multi-phase melting points: 158 °C, 183 °C and 200 °C for flexible workflows
• 📈 Excellent wetting & solder flow for precise, clean joints
• 🧰 Ideal for mobile phone, PCB and electronics repair
• ⚙️ Compatible with hot air, iron and preheater soldering
• 🔩 Reduces bridging and cold joint formation
• 🧪 Stable paste consistency with reduced oxidation
• 📦 50 g professional pack suitable for repair shops
• 📊 Superior pad adhesion and thermal stability
• 🧠 Optimized for fine-pitch and micro-component work
• 🛠️ Professional-grade repair consumable

📊 Technical Specifications