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Amaoe QU-2 Stencil for Qualcomm CPU

Rs.199.00

Amaoe QU-2 Stencil is a precision stainless steel BGA reballing stencil specially designed for Qualcomm CPU chip-level motherboard repair.

Description

Amaoe QU-2 Stencil for Qualcomm CPU

The Amaoe QU-2 Stencil for Qualcomm CPU is engineered for professional mobile repair technicians who specialize in advanced CPU reballing and chip-level servicing. Designed specifically for Qualcomm processors, this stencil ensures precise solder ball alignment and reliable performance during motherboard repair.

Manufactured from premium-grade stainless steel, the QU-2 stencil offers excellent heat resistance, durability, and long-term usability. Its high-precision laser-cut hole pattern guarantees uniform solder ball placement, reducing bridging, short circuits, and rework errors.

Ideal for CPU reballing, IC replacement, and advanced motherboard repairs, the Amaoe QU-2 stencil enhances accuracy and improves overall repair efficiency in professional service centers.


Key Features:

  • High-precision laser-cut BGA stencil
  • Specially designed for Qualcomm CPU reballing
  • Durable stainless steel construction
  • Accurate solder ball positioning
  • Heat resistant and reusable
  • Smooth surface for easy cleaning
  • Minimizes solder bridging and errors
  • Professional-grade chip-level repair tool

Technical Specifications:

  • Brand: Amaoe
  • Model: QU-2
  • Compatibility: Qualcomm CPU IC chips
  • Material: Premium stainless steel
  • Type: BGA Reballing Stencil
  • Manufacturing Technology: Precision laser cutting
  • Application: CPU IC reballing
  • Usage: Mobile motherboard repai

 

Additional information

Weight0.010 kg
Dimensions15 × 12 × 10 cm