Description

Amaoe SAM-2 Stencil for S7

The Amaoe SAM-2 Stencil for S7 is a professional-grade BGA reballing stencil engineered for accurate chip-level repairs on Samsung Galaxy S7 motherboards. Designed with ultra-precise laser-cut technology, this stencil ensures perfect alignment and consistent solder ball placement during reballing processes.

Manufactured from high-quality stainless steel, the SAM-2 stencil offers excellent durability, heat resistance, and long service life. It is ideal for CPU, eMMC, and other IC reballing tasks, making it an essential tool for advanced mobile repair technicians.

Its precise hole pattern ensures smooth solder flow and clean reballing results, reducing repair errors and improving efficiency in professional repair labs.

Key Features:

• High-precision laser-cut BGA stencil
• Specially designed for Samsung Galaxy S7 motherboard
• Durable stainless steel construction
• Accurate solder ball alignment
• Heat resistant and reusable
• Smooth surface for easy cleaning
• Professional-grade chip-level repair tool
• Ensures consistent and reliable reballing results

Technical Specifications:

• Brand: Amaoe
• Model: SAM-2
• Compatibility: Samsung Galaxy S7
• Material: High-quality stainless steel
• Type: BGA Reballing Stencil
• Technology: Laser-cut precision holes
• Application: CPU, eMMC, and IC chip reballing
• Usage: Mobile phone motherboard repair