Amaoe SAM-4 Stencil for A7 / A5 / A3 / S5 / J7

Description

Amaoe SAM-4 Stencil for A7 / A5 / A3 / S5 / J7 – Professional BGA Reballing Tool

The Amaoe SAM-4 Stencil for A7 A5 A3 S5 J7 is specially engineered for professional mobile repair technicians performing advanced chip-level motherboard repairs. Designed for multiple Samsung Galaxy A, S, and J series models, this stencil ensures accurate solder ball alignment during CPU, eMMC, and power IC reballing.

Manufactured from premium-grade stainless steel, the SAM-4 stencil offers exceptional heat resistance and durability for long-term workshop use. Its precision laser-cut hole pattern guarantees uniform solder placement, reducing bridging and increasing overall repair success rates.

Ideal for motherboard rework and IC replacement, the Amaoe SAM-4 stencil delivers clean, consistent, and professional reballing performance.

Key Features:

• High-precision laser-cut BGA stencil
• Compatible with A7, A5, A3, S5 & J7 models
• Durable stainless steel construction
• Accurate solder ball positioning
• Heat resistant and reusable design
• Smooth surface for easy cleaning
• Minimizes solder bridging and repair errors
• Professional tool for chip-level servicing

Technical Specifications:

• Brand: Amaoe
• Model: SAM-4
• Compatibility: Samsung Galaxy A7, A5, A3, S5, J7
• Material: Premium stainless steel
• Type: BGA Reballing Stencil
• Manufacturing Technology: Precision laser cutting
• Application: CPU, eMMC & IC chip reballing
• Usage: Mobile motherboard repair