Description

Amaoe SAM-9 Stencil for J1 J2 J3 J4

The Amaoe SAM-9 Stencil for J1 J2 J3 J4 is a high-quality BGA reballing stencil developed for professional mobile repair technicians. Specifically designed for Samsung Galaxy J series motherboards, it ensures precise solder ball alignment for CPU, eMMC, and other IC rework applications.

Manufactured from premium-grade stainless steel, this stencil provides excellent heat resistance and long-lasting durability. The advanced laser-cut hole pattern guarantees accurate positioning and clean solder ball formation, reducing repair errors and improving efficiency.

Perfect for chip-level servicing and advanced motherboard repairs, the Amaoe SAM-9 stencil helps technicians achieve consistent and reliable reballing results.

Key Features:

• Precision laser-cut BGA stencil
• Compatible with Samsung Galaxy J1, J2, J3 & J4
• High-quality stainless steel construction
• Accurate solder ball alignment
• Heat resistant and reusable
• Smooth surface for easy maintenance
• Ensures clean and consistent reballing
• Ideal for professional chip-level repair

Technical Specifications:

• Brand: Amaoe
• Model: SAM-9
• Compatibility: Samsung Galaxy J1, J2, J3, J4
• Material: Premium stainless steel
• Type: BGA Reballing Stencil
• Technology: High-precision laser cutting
• Application: CPU, eMMC & IC chip reballing
• Usage: Mobile motherboard repair