More items from this sellerView All

Bend Nozzle (8mm) for Quick 861DW SMD Rework Station

Rs.248.00

The 8 mm bend nozzle for Quick 861DW is a curved hot-air accessory designed to deliver concentrated, angled airflow — perfect for side-heating SMDs, ICs, and BGA components.

Description

Bend Nozzle (8mm) for Quick 861DW SMD Rework Station

Upgrade your hot-air rework capabilities with the 8 mm Bend Nozzle, specifically crafted for the Quick 861DW SMD rework station. Its precision-engineered curve design concentrates airflow onto target components, allowing you to heat ICs, BGA chips, and SMD parts with surgical accuracy without disturbing surrounding electronics.

Thanks to its durable heat-resistant alloy construction, this nozzle withstands the high temperatures of daily rework tasks, ensuring long-term reliability and performance. The angled airflow grants you better access to tight corners and awkward component layouts, improving ergonomics during extended repair jobs.

Whether you’re repairing mobile phone motherboards, performing BGA rework, or desoldering fine-pitch ICs, this 8 mm curved nozzle dramatically improves control, efficiency, and safety — making it a must-have accessory for any serious technician using the Quick 861DW.


⭐ Key Features

  • Precision Curved Design: 8 mm internal diameter with a bend for focused, angled airflow.
  • Targeted Heating: Ideal for SMD, IC, BGA and delicate components without affecting nearby parts.
  • Heat-Resistant Alloy Material: Durable build tolerates high rework station temperatures.
  • Easy to Install: Snap-on / push-fit design ensures secure attachment to Quick 861DW handle.
  • Improved Accessibility: Bend allows access to tight or awkwardly positioned components.
  • Ergonomic Operation: Reduces the need for awkward hand positioning during rework.
  • Enhanced Precision: Minimizes heat spread to adjacent components for safer desoldering.
  • High Compatibility: Specifically compatible with the Quick 861DW station.
  • Reliable Performance: Built to last in professional and high-frequency repair environments.
  • Essential for Mobile Repair: Great for mobile motherboard technicians working on tiny, dense circuits.

    ⚙️ Technical Specifications

    SpecificationDetail
    Model / Type8 mm Bend Nozzle (Quick 861DW)
    Inner Diameter8 mm
    DesignCurved / bent shape for angled airflow
    MaterialHeat-resistant alloy metal
    CompatibilityQuick 861DW Hot Air Rework Station
    Use CaseIC desoldering, SMD/BGA repair, side-heating tasks
    InstallationSnap or slide onto the gun’s steel tube
    Maximum Operating TempMatches 861DW’s working range (up to ~500 °C)
    Weight / SizeLightweight, compact nozzle for minimal thermal inertia
    Heat TransferEfficient, focused hot-air flow
    DurabilityLong-lasting under repeated use

Additional information

Weight0.150 kg
Dimensions10 × 10 × 5 cm