JTX T4 Pro Universal IC Chips Glue Removal & Reballing Platform Set

The JTX T4 Pro Universal IC Chips Glue Removal and Reballing Platform Set is a premium fixture for advanced mobile phone and motherboard chip-level repair, built to help technicians perform efficient glue removal and precise reballing (tin planting) across a broad range of chipsets. Featuring a 2-in-1 platform design, it greatly enhances workflow efficiency by combining degumming and reballing in one tool — saving time and reducing repair costs.

Equipped with magnetic automatic clamping and a universal 3D planting tin net, the platform ensures stable, accurate positioning of chips during glue removal or solder ball placement. Its high-precision clamp significantly reduces the risk of component damage during operations, while the advanced magnetic dynamic positioning system provides strong, stable hold and automatic alignment. Built from high-quality steel with excellent wear-resistance, high toughness and heat-resistant properties, this platform delivers long-lasting performance in demanding repair environments.

This set supports chip models from major brands such as Apple (A8 to A18 Pro), Qualcomm, MediaTek Dimensity, Samsung Exynos, Android RAM BGA types and Hisilicon — covering a total of over 80 chip variants. Ideal for iPhone, Samsung, Huawei, Xiaomi, OPPO, Vivo, Honor and other Android device repairs, the JTX T4 Pro is an essential addition to professional repair benches and service centers.

⭐ Key Features

• 2-in-1 Glue Removal & Reballing Platform — Combines degumming and tin planting for efficient IC rework.
• Supports 80+ Chip Models — Broad compatibility with Apple, Samsung, Hisilicon, Qualcomm, Dimensity & more.
• Magnetic Automatic Clamping — Strong magnetic hold for secure chip positioning.
• Universal 3D Tin Planting Stencils — Precision stencil set for accurate solder ball application.
• Precise Positioning — Reduces movement and risk of IC or PCB damage during work.
• High-Quality Steel Construction — Durable, wear-resistant and heat-tolerant for daily shop use.
• Shock-Absorbing & Anti-Slip Base — Stable, reliable operation without slippage.
• Easy to Expand — Support for future stencil additions and expanding chip lists.
• Suitable for RAM/BGA Chips — Works with various BGA RAM and CPU packages.
• Professional Repair Tool — Ideal for labs, refurbishing centers and advanced DIY techs.

⚙️ Technical Specifications