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MagTin Max Magnetic Levitation Tin Planting Platform

Rs.4,298.00

MagTin Max is a magnetic levitation tin planting platform designed for CPU degumming and solder tin planting with strong magnetic adsorption and easy hanging storage.

Out of stock

Description

MagTin Max Magnetic Levitation Tin Planting Platform

The MagTin Max Magnetic Levitation Tin Planting Platform by MECHANIC is a professional-grade solution for precision CPU tinning and degumming tasks. Engineered with a powerful magnetic levitation structure, it securely holds chips and steel stencils in perfect alignment, ensuring clean and uniform solder tin application.

Its brand-new hanging hole design allows convenient wall storage, keeping your workstation organized and efficient. Made from high-temperature resistant composite material, MagTin Max performs reliably during intensive soldering and rework processes without deformation.

The platform’s stable magnetic adsorption system improves tin planting accuracy while reducing chip movement, making it ideal for BGA, CPU, NAND, and IC repair applications. Compact, durable, and technician-friendly, MagTin Max is an essential tool for modern mobile and electronics repair professionals.


Key Features

  • Strong magnetic levitation adsorption for stable tin planting
  • Hanging hole design for easy storage and workspace organization
  • High-temperature resistant construction for soldering operations
  • Precision alignment for clean and uniform tin application
  • Ideal for CPU degumming and BGA tin planting
  • Compact and portable professional repair platform
  • Anti-slip and wear-resistant surface
  • Improves efficiency and soldering accuracy
  • Suitable for advanced chip-level repairs
  • Durable build for long-term workshop use

📊 Technical Specifications

SpecificationDetails
Product NameMagTin Max
TypeMagnetic Levitation Tin Planting Platform
BrandMECHANIC
MaterialHigh-temperature composite
Magnetic SystemStrong magnetic levitation adsorption
Heat ResistanceSuitable for soldering & rework processes
Design FeatureHanging hole for storage
ApplicationCPU degumming, BGA tin planting
CompatibilityCPU, IC, NAND, BGA chips
SurfaceAnti-slip, wear-resistant
UsageProfessional mobile & electronics repair

 

Additional information

Weight0.5 kg
Dimensions15 × 12 × 10 cm