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Mechanic Dr.X Pro Precision Desoldering Wick

Rs.998.00

The MECHANIC Dr.X Pro Precision Desoldering Wick delivers superior solder absorption using ultra-pure oxygen-free copper. Designed for clean, damage-free PCB and IC repairs.

Out of stock

Description

Mechanic Dr.X Pro Precision Desoldering Wick

The MECHANIC Dr.X Pro Precision Desoldering Wick – Super Strong Version sets a new benchmark in professional solder removal. Engineered after 2 years of dedicated R&D, this flagship Dr.X Series wick is designed to solve common desoldering challenges faced by mobile and electronics repair technicians.

Manufactured using 99.9% premium oxygen-free copper, the ultra-fine braided structure ensures rapid heat transfer and 35% higher solder absorption, allowing solder to be removed quickly without overheating sensitive PCB pads or components. The optimized braid density prevents solder splashing and residue buildup, ensuring a cleaner and safer repair process.

With a 3.5mm precision width, this desoldering wick is ideal for IC pins, BGA pads, charging ports, and motherboard solder cleanup. The Super Strong Version offers enhanced durability and consistent performance, making it suitable for high-frequency workshop use. Trusted as a Hong Kong brand, MECHANIC delivers professional-grade reliability for precision electronics repair.


⭐ Key Features

  • 99.9% Oxygen-Free Copper for faster heat conduction
  • 35% Enhanced Solder Absorption for efficient cleanup
  • Super Strong Version with reinforced braid durability
  • Precision Braided Structure prevents PCB pad damage
  • 3.5mm Width ideal for ICs, BGA and motherboard repairs
  • Low Residue Performance for cleaner solder joints
  • Professional Dr.X Series developed after 2 years of R&D
  • Suitable for Lead & Lead-Free Solder
  • Reliable Hong Kong Brand Quality
  • Perfect for Mobile & Electronics Repair Technicians

📊 Technical Specifications

SpecificationDetails
BrandMECHANIC
SeriesDr.X Pro
Product TypePrecision Desoldering Wick
VersionSuper Strong
Width3.5 mm
Material99.9% Oxygen-Free Copper
Solder Absorption35% Enhanced
ApplicationPCB, IC, BGA, Motherboard Repair
CompatibilityLeaded & Lead-Free Solder
OriginHong Kong Brand

 

Additional information

Weight0.100 kg
Dimensions10 × 5 × 5 cm