MIJING Z20 Pro iPhone Middle Layer Motherboard BGA Reballing Stencil Platform Set

Description

MIJING Z20 Pro iPhone Middle Layer Motherboard BGA Reballing Stencil Platform Set

The MIJING Z20 Pro iPhone Middle Layer Motherboard BGA Reballing Stencil Platform Set is a high-precision repair solution designed for advanced mobile technicians handling complex iPhone motherboard repairs. Engineered specifically for middle-layer BGA reballing, this professional platform ensures accurate ball placement and stable alignment during repair work.

Compatible with iPhone X through iPhone 16 Pro Max, the Z20 Pro platform supports precise reballing of middle-layer ICs using a 0.12mm stencil thickness, ensuring consistent solder joints and reducing repair failure rates. Its solid construction and exact positioning system provide excellent stability during heating and reballing processes.

Ideal for professional repair labs and microsoldering experts, the MIJING Z20 Pro BGA reballing stencil platform improves repair efficiency, accuracy and success rates when working on advanced iPhone logic board structures.

⭐ Key Features

• Designed for iPhone Middle Layer Motherboard Repair
• High-Precision BGA Reballing Platform
• Supports iPhone X to iPhone 16 Pro Max
• 0.12mm Stencil Thickness for accurate solder ball formation
• Stable Positioning System prevents board movement
• Professional-Grade Construction for long-term use
• Improves Reballing Accuracy & Success Rate
• Ideal for Advanced Microsoldering Work

⚙️ Technical Specifications