Mijing Z20 Pro Motherboard Middle Layer Planting Tin Platform for iPhone X‑16 Pro

Description

Mijing Z20 Pro Motherboard Middle Layer Planting Tin Platform for iPhone X‑16 Pro

The Mijing Z20 Pro iPhone motherboard reballing platform is a must-have fixture for professional mobile repair workshops and experienced technicians. Designed for iPhone X through iPhone 16 Pro Max, this advanced middle-layer platform simplifies BGA reballing, soldering and tin-planting on high-density motherboards without damage.

Crafted from high-quality, heat-resistant materials and equipped with ultra-precise stencils, the Z20 Pro delivers accurate pad alignment and uniform tin application, helping you achieve clean, consistent results every time. The magnetic, anti-slip base holds motherboards firmly in place, reducing human error and enhancing efficiency during delicate rework jobs.

Whether you’re tackling BGA reballing, component positioning, or PCB soldering, this platform boosts your productivity and ensures a damage-free workflow. Compact and robust, it’s perfect for professionals seeking reliability and accuracy in every repair task.

🌟 Key Features

• Broad iPhone Compatibility: Works with iPhone X up to iPhone 16 Pro Max for versatile repair coverage.
• Precision BGA Reballing: Laser-cut stencil design ensures correct pad alignment and solder placement.
• Magnetic Anti-Slip Base: Securely holds motherboards in place during reballing and soldering.
• High-Quality Construction: Durable materials resist warping and high-temperature stress.
• Heat-Resistant: Built to withstand hot air gun temperatures without distortion.
• Multi-Function Platform: Suitable for reballing, positioning, tin planting, and other PCB tasks.
• Easy to Use: Intuitive layout helps technicians work faster and with confidence.
• Compact & Portable: Ideal for workshop benches and on-the-go repairs.

📊 Technical Specifications