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the MiJing Z21 Max CPU IC Chip Reballing Stencil Station (also marketed for Android & iPhone 6-15PM CPU reballing)

Rs.3,190.00

The MiJing Z21 Max CPU IC Chip Reballing Stencil Station is a precision-engineered tool for mobile motherboard repair that delivers accurate chip alignment and reliable tin planting for iPhone (6-15PM) and Android CPU ICs.

Description

the MiJing Z21 Max CPU IC Chip Reballing Stencil Station (also marketed for Android & iPhone 6-15PM CPU reballing)

Upgrade your CPU and IC reballing workflow with the MiJing Z21 Max CPU IC Chip Reballing Stencil Station — a must-have platform for professional mobile repair technicians and experienced DIYers. Designed for high-precision tin planting and reballing operations, this tool uses strong magnetic positioning and automatic clamping to secure your chip and stencil, ensuring each solder ball is placed exactly where it needs to be.

Whether you’re fixing logic boards on iPhone models from iPhone 6 through iPhone 15 Pro Max or working on popular Android CPUs, the Z21 Max delivers dependable positioning that helps eliminate alignment errors and reduces repair time. The magnet-assisted setup keeps the chip and stencil firmly in place during the entire process, while the durable construction stands up to repeated heating and reflow cycles.

Intuitive to set up and use, this reballing station is ideal for precision soldering tasks — particularly for replacing BGA solder balls on complex processors. With its broad compatibility and robust build, the Z21 Max is an essential addition to your mobile repair bench.


Key Features

  • Wide Reballing Compatibility: Works with CPU chips from iPhone 6 to iPhone 15 Pro Max and many Android platforms.
  • Precision Magnetic Positioning: Strong magnetic force holds chip and stencil firmly for accurate reballing.
  • Automatic Clamping: Magnet-assisted clamping ensures stable chip placement during solder paste application.
  • High Precision Alignment: Reduces errors and improves solder joint quality.
  • Durable Build: Made from high-quality alloy materials resisting deformation and heat exposure.
  • Easy Installation: Simple setup saves time — align chip, place stencil and begin reballing.
  • Suitable for Repair Labs: Perfect for mobile repair shops and professional technicians.
  • Reusable & Cost-Effective: Long-lasting tool that supports multiple CPU formats.

📊 Technical Specifications

SpecificationDetails
Product NameMiJing Z21 Max CPU IC Chip Reballing Stencil Station
BrandMiJing
ModelZ21 Max
ApplicationCPU/IC Reballing & Tin Planting for mobile logic boards
CompatibilityiPhone 6 → iPhone 15 Pro Max; Android CPU platforms (various chipsets)
PositioningMagnetic dynamic original positioning
Clamping MechanismStrong magnetic automatic clamping
MaterialAlloy/steel mesh components (high temperature resistant)
Setup MethodChip alignment → stencil placement → magnetic suction
Use CaseMobile motherboard CPU repair, BGA reballing
Weight~0.25 kg (approx.)

 

Additional information

Weight0.10 kg
Dimensions15 × 12 × 10 cm