Description

RELIFE F-23 100g Solder Flux

RELIFE F-23 100g Solder Flux is a high-performance soldering flux designed to improve solder flow, enhance joint strength, and reduce oxidation during PCB and electronics repair. Specially formulated for precision soldering, it ensures smooth tin spreading and reliable bonding on IC pins, pads, and connectors.

With its balanced viscosity and low-residue formula, RELIFE F-23 provides clean solder joints without leaving excessive contamination. The 100g packaging makes it ideal for professional repair workshops requiring long-term usage. Perfect for BGA rework, SMD soldering, and mobile motherboard repairs, this flux guarantees consistent and efficient results.

⭐ Key Features

• Enhances solder flow and wetting performance
• Reduces oxidation during soldering
• Produces strong, clean, and shiny solder joints
• Low residue and easy to clean
• Suitable for BGA, SMD, and PCB repair
• Balanced viscosity for controlled application
• Ideal for professional mobile repair work
• 100g packaging for extended usage

⚙️ Technical Specifications

• Product Name: RELIFE F-23 100g Solder Flux
• Type: Soldering flux paste
• Net Weight: 100g
• Residue: Low residue formula
• Application: PCB, IC, BGA, SMD soldering
• Compatibility: Leaded and lead-free solder
• Usage: Mobile phone and electronics repair
• Condition: New