Description

Relife HW21S 183° Solder Paste

Relife HW21S 183° Solder Paste is a high-quality low-melting solder paste designed for precision PCB, BGA, and SMD rework applications. With a melting point of 183°C, it ensures smooth solder flow, strong bonding, and reduced thermal stress on sensitive electronic components.

Specially formulated for mobile phone and motherboard repair, this solder paste provides excellent wettability and minimal residue after soldering. Its stable consistency allows accurate stencil printing and precise IC reballing, making it ideal for professional repair technicians and electronics workshops.

Relife HW21S delivers reliable joint strength, improved conductivity, and clean finishing for high-performance soldering tasks.

⭐ Key Features

• 183°C low melting point formula
• Smooth solder flow and strong adhesion
• Ideal for BGA, SMD, and PCB rework
• Reduces thermal damage to components
• Excellent wettability and conductivity
• Minimal residue after soldering
• Stable viscosity for precise application
• Suitable for professional mobile repair

⚙️ Technical Specifications

• Product Name: Relife HW21S 183° Solder Paste
• Melting Point: 183°C
• Type: Low-temperature solder paste
• Application: PCB, BGA, SMD soldering
• Residue Level: Low
• Compatibility: Leaded solder process
• Usage: Mobile phone and electronics repair
• Condition: New