YCS TNZ Microscope Infrared Thermal Imaging Camera for Motherboard Rapid Detected

For electronics repair professionals, service technicians, and quality-control labs, the YCS TNZ Microscope Infrared Thermal Imaging Camera brings a powerful diagnostic upgrade. This thermal-imager attaches to most trinocular or stereo microscopes and combines magnified optical inspection with precise thermal imaging — letting you see both surface details and hidden thermal anomalies. Ideal for PCBs, smartphone motherboards, BGA/IC components, battery inspections and other micro-electronics tasks, the TNZ helps you locate overheating chips, solder faults, shorts or thermal stress points — tasks nearly impossible to catch by naked eye or standard optical microscope alone.

With a high-resolution thermal sensor delivering 49,152 effective temperature-measurement points, variable focus (from as close as 2 mm to infinity), and broad temperature detection range, TNZ ensures accurate, reliable thermal diagnostics even at fine magnification. Its compact, lightweight build and USB-C interface make integration and use on standard workbenches seamless. Whether used for repair, diagnostics, quality inspection, or research — this thermal imaging camera adds a layer of insight that greatly improves fault detection and troubleshooting speed.

🔧 Key Features

• High-Resolution Thermal Sensor (49,152 measurement points) — Delivers detailed thermal maps under the microscope, helping detect micro-hotspots, solder faults, and overheating chips.
• Variable Focus Lens (2 mm ~ ∞) — Adjustable focal distance enables close-up inspection of small components, as well as broader board-level thermal scans.
• Temperature Measurement Range –20 °C to +120 °C (or variant) — Covers common operating and fault-related temperature spans for electronics and battery diagnostics.
• Clip-on Universal Mount for Trinocular Microscopes — Large spring-clip design with up to 87 mm adjustable clamping range, compatible with most stereo/trinocular microscope heads for easy installation.
• USB-C Interface (5 V input, 1.5 m cable) — Power and data over standard USB-C makes it easy to use with PCs, repair benches or microscope setups.
• Dual-Mode Observation: Optical + Thermal — Enables simultaneous visual inspection and infrared diagnostics — ideal for finding both visible defects and hidden thermal issues.
• Compact & Lightweight (≈142.2 g) — Minimal added bulk on top of microscopes, making it convenient for daily repair-bench use. rcuits, overloaded traces, faulty ICs, overheated solder joints or battery cells — saving time and reducing risk of damage.
• Versatile Use Cases — Works for mobile-phone motherboard repair, PC/PCB diagnostics, battery testing, BGA/IC rework, QC lab inspection, training/demonstration, and more.
• Cost-Effective Thermal Upgrade for Microscope Workbenches — Adds powerful infrared diagnostics capability without needing a separate standalone thermal camera setup

📐 Technical Specifications