2UUL BG02 Universal Reballing Stencil AB

Description

2UUL BG02 Universal Reballing Stencil AB

The 2UUL BG02 Universal Reballing Stencil AB is a professional rework tool engineered for precision solder paste application when performing BGA reballing and chip replacement in mobile phone motherboards, tablets and other micro-electronics devices. This universal stencil ensures consistent solder ball alignment and accurate paste deposition, helping technicians achieve clean reball joints and reliable soldering results every time.

Made from high-quality, heat-resistant stainless steel with ultra-fine apertures, the stencil delivers uniform solder paste distribution across the chip pads with minimal mess or waste. Its versatile “AB” design supports a broad range of BGA pad patterns, making it suitable for use in many repair scenarios where generic or universal pad layouts are required.

Whether you’re restoring BGA chips, refreshing old solder joints, or preparing boards for chip-off rework, the 2UUL BG02 Universal Reballing Stencil AB enhances workflow accuracy, reduces rework time and improves overall success rates — especially when paired with hot air rework stations or infrared preheaters.

⭐ Key Features

• 📏 Universal reballing stencil for solder paste application
• 🔩 Supports diverse BGA pad layouts with AB pattern versatility
• 🛠️ Ideal for mobile & electronics rework labs
• 🧲 High-precision aperture array for even solder paste placement
• 📱 Perfect for BGA chip reballing & pad refresh tasks
• 🧰 Durable, heat-resistant stainless steel construction
• ⚙️ Enhances solder joint consistency and repair success
• ✨ Reduces soldering errors & rework time
• 📦 Professional-grade tool for technicians
• 📈 Improves workflow efficiency in board repair

📊 Technical Specifications